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US 9,793,119 B2Granted
Method for structuring a substrate using a protection layer as a mask
AssigneeInfineon Technologies AG
InventorsMartin Mischitz, Markus Heinrici, Florian Bernsteiner
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Abstract
According to various embodiments, a method of processing a substrate may include: disposing a viscous material over a substrate including at least one topography feature extending into the substrate to form a protection layer over the substrate; adjusting a viscosity of the viscous material during a contacting period of the viscous material and the substrate to stabilize a spatial distribution of the viscous material as disposed; processing the substrate using the protection layer as mask; and removing the protection layer after processing the substrate.
Claims17
A method, comprising:
- at least partially filling at least one topography feature extending into a substrate with a sacrificial material;
- disposing a viscous material over the sacrificial material to form a protection layer over the at least one topography feature;
- processing the substrate using the protection layer as mask;
- and
- removing the protection layer and the sacrificial material after processing the substrate.
2 more elements
Dependencies are inferred from the claim text.