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AssigneeAz Electronic Materials (Luxembourg) S.A.R.L.
InventorsToshiya Okamura, Takashi Kanda, Issei Sakurai, Bertram Bernd Barnickel, Hiroyuki Aoki
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[Problem] To provide a perhydropolysilazane making it possible to form a siliceous film with minimal defects, and a curing composition comprising the perhydropolysilazane. [Means for Solution] The present invention provides a perhydropolysilazane having a weight-average molecular weight of 5,000 to 17,000, characterized in that when 1H-NMR of a 17% by weight solution of said perhydropolysilazane dissolved in xylol is measured, the ratio of the amount of SiH1,2 based on the aromatic ring hydrogen content of the xylol is 0.235 or less and the ratio of the amount of NH based on the aromatic ring hydrogen content of the xylol is 0.055 or less, and a curing composition comprising the perhydropolysilazane. The present invention also provides a method for forming a siliceous film, comprising coating the curing composition on a substrate and heating.
A perhydropolysilazane having a weight-average molecular weight of 5,000 to 17,000, characterized in that when 1H-NMR of a 17% by weight solution of said perhydropolysilazane dissolved in xylol is measured, the ratio of the amount of SiH1,2 based on the amount of the aromatic ring hydrogen content of the xylol is 0.235 or less and the ratio of the amount of NH based on the amount of the aromatic ring hydrogen content of the xylol is 0.055 or less, wherein the perhydropolysilazane contains a structure of the following formula:
Dependencies are inferred from the claim text.