Fabricating method of fin field effect transistor (FinFET)
AssigneeUnited Microelectronics Corp.
InventorsChun-Wei Yu, Hsu Ting, Chueh-Yang Liu, Yu-Ren Wang, Kuang-Hsiu Chen, Yi-Liang Ye
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AssigneeUnited Microelectronics Corp.
InventorsChun-Wei Yu, Hsu Ting, Chueh-Yang Liu, Yu-Ren Wang, Kuang-Hsiu Chen, Yi-Liang Ye
Estimating the term…
The invention provides a fabricating method of a FinFET, comprising: providing a substrate having fin structures; depositing an dielectric layer on the substrate filling between the fin structures; forming recesses to reveal a portion of the fin structure by removing a portion of the dielectric layer; performing a cleaning process on using a cleaning solution selected from one of a first solution, consisting of dHF and H2O2, and a second solution, consisting of dHF and DIO3; forming a gate structure across on the fin structures; and forming a source/drain structure on the substrate at two lateral sides of the gate structure. The present invention also provides a fabricating method of a FinFET having an improved cleaning step using a cleaning solution having one of a third solution, consisting of dHF and DIO3, and a fourth solution, consisting of NH4OH and DIO3 before formation of the source/drain structure.
A fabricating method of a fin field effect transistor (FinFET), comprising:
A fabricating method of a fin field effect transistor (FinFET), comprising:
Dependencies are inferred from the claim text.