Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereon
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Jun Park, Kyu Sik Park, Young Sook Lee
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Abstract
There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having the dielectric layer interposed therebetween, electrode layers formed on the first and second end surfaces of the ceramic body and electrically connected to the plurality of internal electrodes, and an impact absorption layer formed on the electrode layer so that an edge thereof is exposed.
Claims11
A multilayer ceramic capacitor comprising:
- a ceramic body including a plurality of dielectric layers;
- a plurality of internal electrodes having at least one of the dielectric layers interposed therebetween;
- an electrode layer formed on a surface of the ceramic body and electrically connected to the plurality of internal electrodes;
- an outer electrode layer formed on the electrode layer;
- and
- an impact absorption layer formed between the electrode layer and the outer electrode layer and including a base resin,
- wherein the outer electrode layer directly contacts the electrode layer, and
- wherein the outer electrode layer is a plating layer.
A circuit board having an electronic component mounted thereon, the circuit board comprising:
- a printed circuit board having first and second electrode pads thereon;
- and
- a multilayer ceramic capacitor installed on the printed circuit board,
- wherein the multilayer ceramic capacitor includes:
- a ceramic body including a plurality of dielectric layers;
- a plurality of internal electrodes having at least one of the dielectric layers interposed therebetween;
- an electrode layer formed on a surface of the ceramic body and electrically connected to the plurality of internal electrodes;
- an outer electrode layer formed on the electrode layer;
- an impact absorption layer formed between the electrode layer and the outer electrode layer and including a base resin;
- and
- wherein the outer electrode layer directly contacts the electrode layer, and
- wherein the outer electrode layer is a plating layer.
Dependencies are inferred from the claim text.