Distributed computing with phase change material thermal management
AssigneeAdvanced Micro Devices, Inc.
InventorsManish Arora, Nuwan Jayasena, Gabriel H. Loh, Michael J. Schulte, Srilatha Manne
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AssigneeAdvanced Micro Devices, Inc.
InventorsManish Arora, Nuwan Jayasena, Gabriel H. Loh, Michael J. Schulte, Srilatha Manne
Estimating the term…
Various apparatus and methods using phase change materials are disclosed. In one aspect, a method of operating a computing device that has a first semiconductor chip with a first phase change material and a second semiconductor chip with a second phase change material is provided. The method includes determining if the first semiconductor chip phase change material has available thermal capacity. If the first semiconductor chip phase change material has available thermal capacity then the first semiconductor chip is instructed to operate in sprint mode. The first semiconductor chip is instructed to perform a first computing task while in sprint mode.
A method of operating a computing device having first semiconductor chip including a first phase change material and a second semiconductor chip including a second phase change material, comprising:
A method of thermally managing a computing device having first semiconductor chip including a first phase change material and a second semiconductor chip including a second phase change material, comprising:
A computing device, comprising:
Dependencies are inferred from the claim text.