Interposer and electronic component

An electronic component comprising first and second electronic parts and an interposer, wherein the first and second electronic devices are disposed on the interposer and electrically interconnected by way of the interposer, the interposer comprising:

• a substrate with upper and lower surfaces;
• at least one through silicon via (TSV), buried in the substrate, that runs through the upper and lower surfaces of the substrate;
• an electrically conductive first shield layer disposed on the upper surface of the substrate;
• an electrically conductive second shield layer;
• disposed on the lower surface of the interposer substrate;
• a first insulation layer disposed on the first shield layer;
• a second insulation layer disposed on the second shield layer;
• a first cable layout layer disposed on the first insulation layer and electrically connected to one or more through silicon vias of the at least one through silicon via;
• a second cable layout layer disposed on the second insulation layer and electrically connected to one or more through silicon vias of the at least one through silicon via;
• at least one first bump disposed at the first cable layout layer and electrically connected to the at least one through silicon via by using the first cable layout layer;
• and
• at least one second bump disposed at the second cable layout layer and electrically connected to the at least one through silicon via by using the second cable layout layer.