Circuit substrate structure and method for manufacturing thereof

A method of manufacturing a circuit substrate structure used to a display, comprising the steps of:

• providing a substrate having a display area and a non-display area,
• forming a pixel array layer on the display area of the substrate,
• forming a display unit on the pixel array layer,
• forming a peripheral circuit layer on the non-display area,
• forming at least one integrated circuit chip on the peripheral circuit layer,
• forming a flexible printed circuit board on the peripheral circuit layer,
• forming at least one flattening material layer on the peripheral circuit layer and laterally adjacent to the display unit and covering a portion of the flexible printed circuit board, wherein the flattening material layer has at least one through hole having a depth equal to a thickness of the display unit, wherein the through hole accommodates and encircles the integrated circuit chip, and the integrated circuit chip is not in direct contact with the flattening material layer, and an edge of the flattening material layer adjacent to the display unit is aligned with an edge of the pixel array layer;
• forming a first sealant in the through hole of the flattening material layer, wherein the first sealant comprises a material different from a material of the flattening material layer;
• forming a second sealant between the display unit and the flattening material layer, wherein the second sealant has a thickness substantially the same as a thickness of the flattening material layer, and the second sealant comprises a material different from a material of the flattening material layer;
• and
• forming a passivation layer on the display unit and the flattening material layer.