Methods, devices and systems that dissipate heat and facilitate optical alignment in optical communications modules

A chip-on-board mounting arrangement for use in an optical communications module for mounting components and for dissipating heat, the arrangement comprising:

• a cold block having a lower surface and at least first, second and third mounting surfaces opposite the lower surface, the cold block being made of a material of high thermal conductivity, the first mounting surface being at a first height, the second mounting surface being at a second height, and the third mounting surface being at a third height, the first, second and third heights corresponding to first, second and third distances of the first, second and third mounting surfaces from the lower surface of the cold block, respectively, at least the first and third heights being different from one another;
• at least a first optoelectronic component mounted on the first mounting surface;
• at least a second optoelectronic component mounted on the second mounting surface;
• and
• a lens assembly mounted on the third mounting surface, wherein mounting the first optoelectronic component, the second optoelectronic component and the lens assembly on the first, second and third mounting surfaces, respectively, optically aligns the first and second optoelectronic components with the lens assembly in directions normal to the first and second mounting surfaces.

A chip-on-board mounting arrangement for use in an optical communications module and for mounting components and for dissipating heat, the arrangement comprising:

• a cold block mounted having a lower surface and at least first and second mounting surfaces opposite the lower surface, the cold block being made of a material of high thermal conductivity, the first mounting surface being at a first height and the second mounting surface being at a second height, the first and second heights corresponding to first and second distances of the first and second mounting surfaces from the lower surface of the cold block, respectively, the first and second heights being different from one another;
• at least first and second optoelectronic components mounted on the first mounting surface;
• and
• a lens assembly mounted on the second mounting surface, the lens assembly comprising at least first and second lens blocks having lower surfaces that are in abutment with the second mounting surface, the second lens block having an offset formed in a portion of the lower surface thereof that offsets an optical surface of the second lens block from a non-offset portion of the lower surface of the second lens block, wherein mounting the first and second optoelectronic components on the first mounting surface and mounting the first and second lens blocks on the second mounting surface optically aligns the first and second optoelectronic components with the first and second lens blocks, respectively, in directions normal to the first and second mounting surfaces.