Method for fabricating an embedded pattern using a transfer-based imprinting

A method for fabricating an embedded pattern using a transfer-based imprinting, the method comprising:

• forming an adhesive layer on a substrate, the adhesive layer having a photo curable resin;
• preparing a stamp having a plurality of protrusions of a uniform height, a thin-film layer being formed on the plurality of protrusions of the stamp, the thin-film layer having a metal material;
• selectively transferring the thin-film layer on the plurality of protrusions to the adhesive layer;
• irradiating ultraviolet rays (UV) to cure the adhesive layer;
• and
• removing the stamp,
• wherein the selectively transferring the thin-film layer comprises:
• making the thin-film layer on the plurality of protrusions contact with the adhesive layer;
• pressing the stamp such that portions of the adhesive layer in contact with the plurality of protrusions are depressed and the thin-film layer on the plurality of protrusions are embedded in the depressed portions of the adhesive layer;
• and
• controlling a temperature to increase an adhesive force between the adhesive layer and the thin-film layer,
• wherein the pressing is performed such that a depth of the depressed portions of the adhesive layer is substantially same as or greater than a thickness of the thin-film layer embedded in the depressed portions of the adhesive layer, and
• wherein, when the depth of the depressed portions of the adhesive layer obtained by said pressing is greater than the thickness of the thin-film layer embedded in the depressed portions of the adhesive layer, the method further comprises, after the selectively transferring,
• planarizing the adhesive layer such that an upper surface of the adhesive layer in portions other than the depressed portions becomes coplanar with an upper surface of the thin-film layer transferred to and embedded in the depressed portions of the adhesive layer.