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US 9,791,501 B2Granted
Compliant thermal contact device and method
AssigneeIntel Corporation
InventorsPaul Diglio, David W. Song
Life of this patent
Estimating the term…
Abstract
Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations.
Claims15
A thermal contact device, comprising;
- a first physically compliant thermally conducting device contact pad;
- a first number of thermal conducting structures protruding from the device contact pad;
- a heat distributing pad located adjacent to the device contact pad, and movable with respect to the device contact pad;
- a second number of thermal conducting structures protruding from the heat distributing pad, wherein the first number of thermal conducting structures and the second number of thermal conducting structures are interleaved with one another;
- two rigid thermally conducting device contact pads located adjacent to the first physically compliant thermally conducting device, wherein the first physically compliant thermally conducting device contact pad and the two rigid thermally conducting device contact pads are each configured to simultaneously be in communication with individual chips of a number of chips to be tested;
- and
- a heat source separate from the number of chips to be tested, the heat source coupled to the heat distributing pad.
4 more elements
A thermal testing device, comprising;
- a test fixture base;
- a plurality of semiconductor chip thermal test fixtures coupled to the test fixture base, wherein at least one semiconductor chip thermal test fixture is a physically compliant semiconductor chip thermal test fixture capable of moving independently from other fixed thermal test fixtures in the plurality, and at least one other semiconductor chip thermal test fixture is a rigid semiconductor chip thermal test fixture, the physically compliant semiconducting thermal test fixture including:
- a thermally conducting device contact pad;
- a first number of thermal conducting structures protruding from the device contact pad;
- a heat distributing pad located adjacent to the device contact pad, and movable with respect to the device contact pad;
- a second number of thermal conducting structures protruding from the heat distributing pad, wherein the first number of conducting structures and the second number of conducting structures are interleaved with one another,
- a viscous thermal interface material in contact between the first number of thermal conducting structures and the second number of thermal conducting structures;
- and
- a heat source separate from a number of chips to be tested, the heat source coupled to each heat distributing pad in the number of test fixtures;
- and
- wherein the plurality of semiconductor chip thermal test fixtures are each configured to be in communication with individual chips of the number of chips to be tested.
8 more elements
Dependencies are inferred from the claim text.