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US 9,791,470 B2Granted
Magnet placement for integrated sensor packages
AssigneeIntel Corporation
InventorsFeras Eid, Sasha N. Oster, Kyu Oh Lee, Sarah Haney
Life of this patent
Estimating the term…
Abstract
Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.
Claims20
A method comprising:
- forming a metal mechanical sensor structure in a sensor metal layer of a package substrate;
- forming a top metal layer of the package substrate over the sensor metal layer, the top layer of the substrate defining pads on opposite sides of the sensor structure;
- applying a dielectric layer over the top metal layer, the dielectric layer extending across the sensor structure from one side to an opposite side of the sensor structure and patterned to expose the pads;
- applying connection terminals to a magnet;
- placing the magnet over the top metal layer of the substrate over the pads and over the sensor structure with solder between the terminals and the pads, the magnet being positioned to produce a magnetic field to influence the sensor structure;
- and
- reflowing the solder to attach the magnet to the substrate.
4 more elements
An apparatus comprising:
- a magnet having attachment terminals;
- and
- an integrated sensor package having a metal mechanical sensor structure in a sensor metal layer of a package substrate, a top metal layer over the sensor metal layer defining pads on opposite sides of the sensor structure, a dielectric layer over the top metal layer extending across the sensor structure from one side to an opposite side of the sensor structure and patterned to expose the pads, the magnet being placed over the pads and over the sensor structure of the substrate in a position to produce a magnetic field to influence the sensor structure and having a reflowed solder connection between the magnet attachment terminals and the pads to attach the magnet to the substrate.
A computing device having an integrated sensor package, the package comprising:
- a magnet having an attachment terminal;
- an integrated circuit die in the package;
- and
- an integrated sensor package having a metal mechanical sensor structure in a sensor metal layer of a package substrate, a top metal layer over the sensor metal layer defining pads on opposite sides of the sensor structure, a dielectric layer over the top metal layer extending across the sensor structure from one side to an opposite side of the sensor structure and patterned to expose the pads, the magnet being placed over the pads and over the sensor structure of the substrate in a position to produce a magnetic field to influence the sensor structure and having a reflowed solder connection between the magnet attachment terminals and the pads to attach the magnet to the substrate.
1 more element
Dependencies are inferred from the claim text.