Pressure sensor capable of improving assembling efficiency by using spring electrode
AssigneeMando Corporation
InventorGon Jae Lee
Life of this patent
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AssigneeMando Corporation
InventorGon Jae Lee
Estimating the term…
Disclosed is to a pressure sensor including: a metal diaphragm configured to have a pressure sensing part disposed thereover; a first support configured to be coupled with the metal diaphragm; a first printed circuit board configured to be disposed over the pressure sensing part while being supported to the first support and electrically connected to the pressure sensing part; a connector configured to have a lower portion press-fitted with the first printed circuit board; a second printed circuit board configured to be electrically connected to the first printed circuit board through the connector while being press-fitted with an upper portion of the connector and supported by the connector; a second support configured to be disposed over the second printed circuit board; and a spring electrode configured to have an upper end protruding upward of the second support and have a lower end connected to the second printed circuit board.
A pressure sensor, comprising:
Dependencies are inferred from the claim text.