Thermal type flowmeter
AssigneeHitachi Automotive Systems, Ltd.
InventorsShinobu Tashiro, Noboru Tokuyasu, Tsutomu Kono, Takeshi Morino, Tsubasa Watanabe
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Abstract
In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, a method of manufacturing a thermal type flowmeter is provided that includes a circuit package of a resin-molded semiconductor chip. The method includes resin-molding the semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.
Claims9
A method of manufacturing a thermal type flowmeter that includes a circuit package of a resin-molded semiconductor chip, the method comprising:
- resin-molding a semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.
Dependencies are inferred from the claim text.