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US 9,791,119 B2Granted
Light emitting module and head lamp including the same
AssigneeLG Innotek Co., Ltd.
InventorsNam Seok Oh, Yun Min Cho, Jong Woo Lee
Life of this patent
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Abstract
Disclosed is a light emitting module including a light emitting device package having a circuit board having a cavity, an insulation substrate arranged in the cavity, with a conductive pattern formed thereon, and at least one light emitting device disposed on the insulation substrate, with being electrically connected with the conductive pattern; and a glass cover located on the light emitting device package, with lateral surfaces, a top surface and an open bottom surface, wherein the light emitting device package and the circuit board are electrically connected with each other.
Claims19
A light emitting module comprising:
- a light emitting device package comprising a circuit board having a metal substrate;
- an insulation substrate having a conductive pattern disposed on the metal substrate, and at least one light emitting device disposed on the insulation substrate, and being electrically connected with the conductive pattern;
- a supporting part disposed on a predetermined portion of the circuit board;
- a glass cover disposed on the light emitting device package, with lateral surfaces and a top surface;
- a pad electrically connected with the light emitting device package via a wire;
- and
- an insulation layer disposed on the metal substrate, the pad being disposed on a top surface of the insulation layer,
- wherein the supporting part includes a first portion and a second portion, a height of the first portion being lower than a height of the second portion,
- wherein the first portion supports the glass cover,
- wherein a distance between the top surface of the glass cover and a bottom surface of the circuit board is smaller than a distance between a top surface of the second portion and the bottom surface of the circuit board, and
- wherein a distance between a top surface of the insulation substrate and the bottom surface of the circuit board is equal to a distance between the top surface of the insulation layer and the bottom surface of the circuit board.
8 more elements
A light emitting module comprising:
- a light emitting device package comprising a circuit board having a metal substrate;
- an insulation substrate having a conductive pattern disposed on the metal substrate, and at least one light emitting device disposed on the insulation substrate, and being electrically connected with the conductive pattern;
- a glass cover disposed on the light emitting device package;
- a pad electrically connected with the light emitting device package via a wire;
- and
- an insulation layer disposed on the metal substrate, the pad being disposed on a top surface of the insulation layer,
- wherein at least one groove is formed on a surface of the insulation substrate, and the conductive pattern is disposed in the groove,
- wherein a distance between a top surface of the insulation substrate and a bottom surface of the circuit board is equal to a distance between a top surface of the conductive pattern and the bottom surface of the circuit board, and
- wherein the distance between the top surface of the insulation substrate and the bottom surface of the circuit board is equal to a distance between the top surface of the insulation layer and the bottom surface of the circuit board.
6 more elements
A head lamp comprising:
- a light emitting module configured to emit a light;
- a reflector configured to reflect the light emitted from the light emitting module;
- and
- a lens configured to refract the light emitted from the light emitting module and the light reflected by the reflector,
- wherein the light emitting module comprises:
- a light emitting device package comprising a circuit board having a metal substrate;
- an insulation substrate having a conductive pattern disposed on the metal substrate, and at least one light emitting device disposed on the insulation substrate, and being electrically connected with the conductive pattern;
- an insulation layer disposed on the metal substrate;
- a supporting part disposed on a predetermined portion of the circuit board;
- a glass cover disposed on the light emitting device package, with lateral surfaces and a top surface,
- wherein the supporting part includes a first portion and a second portion, a height of the first portion being lower than a height of the second portion, and wherein the first portion supports the glass cover,
- wherein the metal substrate has a constant thickness, and
- wherein a distance between a top surface of the insulation substrate and a bottom surface of the circuit board is equal to a distance between a top surface of the insulation layer and the bottom surface of the circuit board.
10 more elements
Dependencies are inferred from the claim text.