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AssigneeRohm and Haas Electronics Materials LLC
InventorKoichi Yomogida
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To provide a surface treatment solution and treatment method for gold or gold alloy plating that effectively suppresses corrosion of underlying metal or substrate metal from pinholes that develop on the gold or gold alloy plating film. [Solution] A surface treatment solution containing a disulfide compound is brought into contact with a gold or gold alloy plating film. A compound represented by the following formula (2) is preferred as the disulfide compound. X1O3S—R3—S—S—R4—SO3X2 (2) in the formula, R3 and R4 independently represent a linear or branched alkylene group having from 1 to 10 carbon atoms, cyclic alkylene group having from 3 to 10 carbon atoms, or phenylene group, R3 and R4 independently may be substituted by one or more substituents selected from an alkyl group, halogen atom, hydroxyl group, or alkoxy group, and X1 and X2 represent monovalent cations.
A surface treatment method for gold or gold alloy plating film formed on nickel or nickel alloy underlayer, wherein the surface treatment method comprises a step for bringing the gold or gold alloy plating film formed on the nickel or nickel alloy underlayer into contact with a surface treatment solution consisting of water, at least one type of disulfide compound, wherein the disulfide compound is represented by the following formula (2):
Dependencies are inferred from the claim text.