Etching agent for copper or copper alloy
AssigneeEntegris, Inc.
InventorsTsutomu Kojima, Yukichi Koji
Life of this patent
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Abstract
Object is to provide an etching solution which generates less foam and can etch copper or copper alloy at high selectivity when used in a step of etching copper or 5 copper alloy in an electronic substrate having both of copper or copper alloy and nickel. The etching solution to be used in a step of selectively etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel has, as essential components thereof, (A) a linear alkanolamine, (B) a chelating agent having an acid group in the molecule thereof, and (C) hydrogen peroxide.
Claims16
A method of manufacturing an electronic substrate, comprising a step of using an etching solution for copper or copper alloy to selectively etch copper or copper alloy in an electronic substrate having both copper or copper alloy and nickel, wherein said etching solution comprises (A) a linear alkanolamine, (B) a chelating agent having an acid group in the molecule thereof, and (C) hydrogen peroxide, wherein the chelating agent (B) is an (i) organic acid having two or more phosphonic acid groups as the acid group or salts thereof, (ii) organic acid having two or more sulfonic acid groups as the acid group or salts thereof, or (iii) organic acids containing one or more carboxyl groups and one or more phosphonic acid groups as the acid group or salts thereof.
Dependencies are inferred from the claim text.