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US 9,790,589 B2Granted
Gas cooled substrate support for stabilized high temperature deposition
AssigneeApplied Materials, Inc.
InventorsBrian West, Michael S. Cox, Jeonghoon Oh
Life of this patent
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Abstract
Embodiments of the present disclosure provides apparatus and method for stabilizing substrate temperature by flowing a flow of cooling gas to an inlet of cooling channels in a substrate support, receiving the flow of cooling gas from an outlet of the cooling channel using a heat exchanger, and releasing the cooling gas to an immediate environment, such as a cleanroom or a minienvironment.
Claims20
A pedestal assembly, comprising:
- an electrostatic chuck having a substrate supporting surface;
- a base plate attached to the electrostatic chuck and having cooling channels formed therein, wherein the cooling channels have an inlet passage and an outlet passage;
- and
- a cooling assembly connected to the cooling channels via the inlet passage and the outlet passage, wherein the cooling assembly comprises:
- an inlet coupled to a gas source;
- an outlet open to an immediate environment outside a processing chamber wherein the base plate is disposed;
- a flow controller coupled between the inlet and the inlet passage;
- and
- a heat exchanger coupled to the outlet, wherein the heat exchanger is not coupled between the inlet and the inlet passage.
6 more elements
An apparatus for processing a semiconductor substrate, comprising:
- a chamber body defining a processing volume;
- a pedestal assembly for supporting one or more substrate during processing, wherein the pedestal assembly comprises:
- an electrostatic chuck having a substrate supporting surface and disposed in the processing volume;
- and
- a base plate attached to the electrostatic chuck, wherein the base plate has cooling channels formed therein, wherein the cooling channels have an inlet passage and an outlet passage;
- and
- a cooling assembly connected to the cooling channels of the pedestal assembly via the inlet passage and the outlet passage, wherein the cooling assembly is disposed outside the processing volume, and the cooling assembly comprises:
- an inlet coupled to a gas source;
- an outlet open to an immediate environment outside the chamber body;
- a flow controller coupled between the inlet and the inlet passage;
- and
- a heat exchanger coupled to the outlet, wherein the heat exchanger is not coupled between the inlet and the inlet passage.
9 more elements
A method for controlling temperature of a substrate being processed, comprising:
- processing a substrate on a substrate support in a processing chamber;
- supplying a flow of cooling gas to an inlet passage of cooling channels formed in the substrate support to control temperature of the substrate;
- flowing the flow of cooling gas exiting the cooling channels through a heat exchanger, wherein the heat exchanger is not connected with the inlet passage;
- and
- releasing the flow of cooling gas from the heat exchanger to an environment surrounding the processing chamber.
2 more elements
Dependencies are inferred from the claim text.