Thermally expandable preparations
AssigneeHenkel AG & Co. KGaA
InventorsEmilie Barriau, Martin Renkel, Rainer Schoenfeld, Sven Wucherpfennig, Tim Welters
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Abstract
The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.
Claims13
A thermally expandable preparation pumpable at application temperatures below 70° C., comprising
- (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity at 25° C. of at most 1250 Pa*s,
- (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity at 25° C. of at most 250 Pa*s,
- (c) at least one thermally activatable hardener,
- (d) at least one thermally activatable blowing agent,
- (e) at least 1 wt. % organic fibers having a fiber length from 0.2 mm to 10 mm, and
- (f) at least 20 wt. % fillers.
Dependencies are inferred from the claim text.