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US 9,790,319 B2Granted
Curing agents for low-emission epoxy resin products
AssigneeSika Technology AG
InventorsEdis Kasemi, Andreas Kramer, Ursula Stadelmann, Urs Burckhardt
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Abstract
The present invention relates to curing agents for epoxy resins, containing at least one adduct of trimethylhexamethylenediamine and cresyl glycidyl ether. The curing agent has a low viscosity and cures quickly together with epoxy resins even in moist, cold conditions and without blushing to form films with a high hardness and surface quality, which scarcely undergo yellowing upon exposure to light. It is particularly suited for low-emission room temperature-curing coatings.
Claims19
A curing agent, suitable for curing epoxy resins, comprising:
- at least one adduct of trimethylhexamethylenediamine and cresyl glycidyl ether,
- wherein the adduct is a reaction product of trimethylhexamethylenediamine and cresyl glycidyl ether in a trimethylhexamethylenediamine molecules/cresyl glycidyl ether molecules ratio in a range of 0.9 to 2.0.
Dependencies are inferred from the claim text.