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US 9,790,313 B2Granted
Curing compositions and methods of preparing
AssigneeHexion Inc.
InventorsGanapathy S. Viswanathan, Craig M. Zirkle
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Abstract
Disclosed are curing compositions for resin systems and in particular for phenolic resin systems and epoxy resin systems, to methods of preparing the curing compositions and to resin systems incorporating same. The curing compositions of the invention are the reaction product of an aldehyde with an amine in the presence of an aprotic solvent.
Claims9
A curing composition for a resin system comprising a reaction product consisting essentially of:
- paraformaldehyde;
- melamine;
- and
- N-methylpyrrolidinone (NMP), and wherein the reaction product is an intermediate product having the structure:
- and wherein the melamine:
- paraformaldehyde mole ratio is from about 1:3 to about 1:8.
3 more elements
Dependencies are inferred from the claim text.