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US 9,790,246 B2Granted
Nickel compound and method of forming thin film using the nickel compound
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-chul Youn, Gyu-hee Park, Youn-joung Cho, Haruyoshi Sato, Takanori Koide, Naoki Yamada, Akio Saito, Akihiro Nishida
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Abstract
Provided are a heterostructured nickel compound including a nickel amidinate ligand and an aliphatic alkoxy group and a method of forming a thin film including the heterostructured nickel compound. The method includes forming a nickel-containing layer on a substrate by using the heterostructured nickel compound including the nickel amidinate ligand and the aliphatic alkoxy group.
Claims3
A heterostructured nickel compound comprising:
- a nickel amidinate ligand;
- and
- an aliphatic alkoxy group,
- wherein the nickel compound is represented by the following Formula (I):
- where each of R1 and R2 is a C1-C6 linear or branched alkyl group;
- each of R3, R4, and R5 is hydrogen or a C1-C4 linear or branched alkyl group;
- each of R6 and R7 is a C1-C4 linear or branched alkyl group;
- and
- A is a C1-C3 alkanediyl group.
6 more elements
Dependencies are inferred from the claim text.