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US 9,790,090 B2Granted
Laser-induced gas plasma machining
AssigneeLawrence Livermore National Security, LLC
InventorsSelim Elhadj, Isaac Louis Bass, Gabriel Mark Guss, Manyalibo J. Matthews
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Abstract
Techniques for removing material from a substrate are provided. A laser beam is focused at a distance from the surface to be treated. A gas is provided at the focus point. The gas is dissociated using the laser energy to generate gas plasma. The substrate is then brought in contact with the gas plasma to enable material removal.
Claims10
A method for removing material using plasma machining, the method comprising:
- providing a substrate having a first surface and an opposing second surface;
- passing a converging laser beam through the first surface, the substrate, and the opposing second surface to a location outside the substrate;
- focusing the laser beam, after the laser beam has passed through the opposing second surface, at a focus point located outside the substrate and at a first distance beyond the opposing second surface of the substrate;
- providing a gas at or near the focus point;
- generating gas plasma by breaking down the gas using energy from the laser beam, the gas plasma being oriented away from the focus point and towards the opposing second surface of the substrate;
- exposing a portion of the opposing second surface outside the substrate to the gas plasma;
- and
- removing material from the portion of the opposing second surface using plasma machining.
5 more elements
Dependencies are inferred from the claim text.