MEMS sensor with side port and method of fabricating same

A method of making microelectromechanical systems (MEMS) sensor packages comprising:

• providing a substrate having a first inner surface and a second outer surface, said substrate including a first MEMS sensor at a first region of said first inner surface and a second MEMS sensor at a second region of said first inner surface, said second region being laterally displaced from said first region;
• providing a cap layer having a second inner surface and a second outer surface, said cap layer including a first cavity and a second cavity laterally displaced from said first cavity, each of said first and second cavities extending inwardly from said second inner surface;
• forming a channel extending inwardly from one of said first inner surface of said substrate and said second inner surface of said cap layer;
• coupling said second inner surface of said cap layer to said first inner surface of said substrate such that said first cavity overlies said first region to form a first intermediate sensor structure, said second cavity overlies said second region to form a second intermediate sensor structure, and said channel is interposed between said first and second cavities;
• coupling a first semiconductor die to said one of said first outer surface of said substrate and said second outer surface of said cap layer of said first intermediate sensor structure;
• coupling a second semiconductor die to said one of said first outer surface of said substrate and said second outer surface of said cap layer of said second intermediate sensor structure;
• and
• following coupling of said first and second semiconductor dies to said first and second intermediate sensor structures, separating said first intermediate sensor structure from said second intermediate sensor structure to produce a first MEMS sensor package and a second MEMS sensor package, wherein said separating comprises splitting said channel into a first portion and a second portion, said first portion forming a first port extending between said first cavity and a first side wall of said first MEMS sensor package, and said second portion forming a second port extending between said second cavity and a second side wall of said second MEMS sensor package, each of said first and second side walls extending between said first outer surface of said substrate and said second outer surface of said cap layer, and following said separating said first MEMS sensor package further includes said first semiconductor die and said second MEMS sensor package further includes said second semiconductor die.

A method of making microelectromechanical systems (MEMS) sensor packages comprising:

• providing a substrate having a first inner surface and a second outer surface, said substrate including a first MEMS sensor at a first region of said first inner surface and a second MEMS sensor at a second region of said first inner surface, said second region being laterally displaced from said first region;
• providing a cap layer having a second inner surface and a second outer surface, said cap layer including a first cavity and a second cavity laterally displaced from said first cavity, each of said first and second cavities extending inwardly from said second inner surface;
• forming a channel extending inwardly from one of said first inner surface of said substrate and said second inner surface of said cap layer;
• coupling said second inner surface of said cap layer to said first inner surface of said substrate such that said first cavity overlies said first region to form a first intermediate sensor structure, said second cavity overlies said second region to form a second intermediate sensor structure, and said channel is interposed between said first and second cavities;
• encapsulating said substrate and said cap layer in an encapsulant by overmolding using a mold compound or a resin system;
• and
• following said encapsulating, separating said first intermediate sensor structure from said second intermediate sensor structure to produce a first MEMS sensor package and a second MEMS sensor package, wherein said separating comprises:
• separating said encapsulant such that a first portion of said encapsulant remains overlying said first intermediate structure and a second portion of said encapsulant remains overlying said second intermediate structure;
• and
• splitting said channel into a first portion and a second portion, said first portion forming a first port extending between said first cavity and a first side wall of said first MEMS sensor package, and said second portion forming a second port extending between said second cavity and a second side wall of said second MEMS sensor package, each of said first and second side walls extending between said first outer surface of said substrate and said second outer surface of said cap layer, wherein following said separating, said encapsulant does not obstruct said first and second ports, said first port is configured to admit a fluid external to said first cavity into said first cavity, and said second port is configured to admit said fluid external to said second cavity into said second cavity.