MEMS structure and method of fabricating the same

A MEMS structure comprising:

• a substrate comprising a logic element region and a MEMS region;
• a logic element disposed within the logic element region;
• a nitrogen-containing material layer covering the logic element, the logic element region and the MEMS region, wherein at least one shrinking region is defined in the nitrogen-containing material layer, and there is no nitrogen-containing material layer inside the shrinking region;
• a dielectric layer covering the logic element region and the MEMS region, and the dielectric layer filling in the shrinking region;
• at least one releasing hole disposed inside the dielectric layer within the shrinking region, wherein the shrinking region surrounds the releasing hole;
• and
• a chamber disposed in the substrate within the MEMS region, wherein the chamber and the releasing hole form a vibration chamber.