Micromechanical sensor device
AssigneeRobert Bosch GmbH
InventorsArnd Kaelberer, Jochen Reinmuth
Life of this patent
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Abstract
A micromechanical sensor device includes an evaluation circuit formed in a first substrate, and an MEMS structure which is situated in a cavity delimited by a second substrate and a third substrate, the MEMS structure and the second substrate being situated on top of each other, the MEMS structure being functionally connected to the evaluation circuit via a contact area, the contact area between the MEMS structure and the first substrate being situated essentially centrally on the second substrate and essentially centrally on the first substrate and has an essentially punctiform configuration, proceeding radially from the contact area, a clearance being formed between the first substrate and the second substrate.
Claims16
A micromechanical sensor device, comprising:
- an evaluation circuit formed in a first substrate;
- and
- an MEMS structure which is situated in a cavity delimited by a second substrate and a third substrate, the MEMS structure being situated on top of the second substrate, the MEMS structure being functionally connected to the evaluation circuit via a contact area;
- wherein the contact area between the MEMS structure and the first substrate is situated essentially centrally on the second substrate and essentially centrally on the first substrate and has an essentially punctiform configuration;
- wherein a clearance, proceeding radially from the contact area, is formed between the first substrate and the second substrate;
- wherein the MEMS structure is functionally connected to the evaluation circuit via an electrically conducting connection made of highly doped silicon of the second substrate:
- and wherein the clearance has a defined clear opening,
- wherein the electrically conducting connection is delimited by insulating trenches,
- wherein the insulating trenches are hollow through channels situated in the second substrate;
- wherein the electrically conducting connection has a first electrically conducting connection section and a second electrically conducting connection section;
- wherein the first electrically conducting connection is delimited by a first hollow through channel and a ventilation channel which has an access to a cavern including an MEMS structure;
- and
- wherein the second electrically conducting connection is delimited by a second hollow through channel and the ventilation channel.
A method for manufacturing a micromechanical sensor device, the method comprising:
- forming an evaluation circuit in a first substrate;
- forming an MEMS structure in a cavity which is delimited by a second substrate and by a third substrate;
- and
- forming a contact area between the MEMS structure and the evaluation circuit so that, proceeding radially from the contact area, a clearance is formed between the first substrate and the second substrate;
- wherein the MEMS structure is functionally connected to the evaluation circuit via an electrically conducting connection made of highly doped silicon of the second substrate;
- and
- wherein the clearance has a defined clear opening,
- wherein the contact area is a eutectic bond formed using a eutectic bonding method,
- wherein the insulating trenches are hollow through channels situated in the second substrate;
- wherein a ventilation channel which has an access to a cavern including an MEMS structure is situated between the insulating trenches that delimit the electrically conducting connection;
- wherein the electrically conducting connection has a first electrically conducting connection section and a second electrically conducting connection section;
- wherein the first electrically conducting connection is delimited by a first hollow through channel and the ventilation channel;
- and
- wherein the second electrically conducting connection is delimited by a second hollow through channel and the ventilation channel.
Dependencies are inferred from the claim text.