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US 9,789,688 B2Granted
Electronic device, and method for manufacturing electronic device
AssigneeSeiko Epson Corporation
InventorNaoya Sato
Life of this patent
Estimating the term…
Abstract
A bonding resin that bonds substrates to each other in a state of being spaced with a gap between the substrates is configured by stacking a photosensitive resin and a bonding reinforcement resin which is different from the photosensitive resin, the photosensitive resin is patterned in one substrate, and the bonding reinforcement resin which is stacked on the patterned photosensitive resin has a fillet being a wet-spreading portion or a portion which swells outward from the photosensitive resin.
Claims6
An electronic device comprising:
- a first substrate;
- and
- a second substrate that is bonded to the first substrate in a state of being spaced from each other with a gap by interposing a bonding resin between the first substrate and the second substrate,
- wherein:
- the bonding resin is configured by stacking a photosensitive resin and a bonding reinforcement resin which is different from the photosensitive resin,
- the photosensitive resin is patterned on at least one substrate of the first substrate and the second substrate, and
- the bonding reinforcement resin which is stacked on the patterned photosensitive resin, has a wet-spreading portion or a portion which swells outward from the photosensitive resin,
- wherein at least one of the first and second substrates includes a bump electrode.
5 more elements
Dependencies are inferred from the claim text.