Bonding device and method for producing plate-shaped bonded assembly

A bonding device comprising:

• a pair of plate-shaped members;
• a pair of retaining base members that retains the pair of plate-shaped members facing each other;
• a retaining base member movement unit that causes movement of the pair of retaining base members towards and away from each other;
• an illumination unit that illuminates curing light to a photo-curable liquid material charged between the pair of plate-shaped members held by the pair of retaining base members;
• and
• a sensor that detects a wetting spreading state of the liquid material charged between the pair of plate-shaped members,
• wherein one of the pair of plate-shaped members is a transparent panel of a display device,
• wherein one retaining base member of the pair of retaining base members comprises a sensor opening near outer lateral side edges of the one of the pair of plate-shaped members retained by the retaining base member,
• wherein the sensor illuminates laser light to one of the pair of plate-shaped members via the sensor opening, and
• wherein the illumination unit illuminates the curing light to the liquid material that is wettingly spread to near the outer lateral side edges of the pair of plate-shaped members, based on the result of detection by the sensor.