Solder material and bonded structure
AssigneePanasonic Intellectual Property Managment Co., Ltd.
InventorsAkio Furusawa, Kiyohiro Hine, Masato Mori, Taichi Nakamura
Life of this patent
Estimating the term…
Abstract
Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0<[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0<[Cu]<0.5, In in a range of 5.2+(6−(1.55×[Cu]+4.428))≦[In]≦6.8 when [Cu] falls within a range of 0.5≦[Cu]≦1.0, In in a range of 5.2≦[In]≦6.8 when [Cu] falls within a range of 1.0<[Cu]≦1.2. A balance includes only not less than 87 mass % of Sn.
Claims12
Solder material used in soldering a component electrode and a substrate electrode,
- where the component electrode includes an Au electrode and a Cu electrode, or the substrate electrode includes an Au electrode and a Cu electrode, the solder material comprising:
- Ag (silver) satisfying 0.3≦[Ag]<4.0;
- where 0.5 mass % and 1.0 mass % of Ag are excluded,
- Bi (bismuth) satisfying 0≦[Bi]≦1.0;
- Cu (copper) satisfying 0.2≦[Cu]≦1.2;
- In (indium) in a range of 6.0≦[In]6.8 when [Cu] falls within a range of 0.2≦[Cu]<0.5;
- In in a range of 5.2+(6−(1.55×[Cu]+4.428))≦[In]6.8 when [Cu] falls within a range of 0.5[Cu]1.0;
- and
- In in a range of 5.2≦[In]≦6.8 when [Cu] falls within a range of 1.0<[Cu]≦1.2,
- with a balance including 87≦[Sn],
- where contents (mass %) of Ag, Bi, Cu, In, and Sn (tin) in the solder material are denoted by [Ag], [Bi], [Cu], [In] and [Sn], respectively.
Dependencies are inferred from the claim text.