Component mounting method
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYoshihiro Mimura, Ryuji Hamada, Akira Kameda
Life of this patent
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Abstract
While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.
Claims2
A component mounting method operatively associated with a component mounting device said component mounting method comprising:
- a component loading operation unit that performs an operation for loading components on a substrate, a first component crimping operation unit and a second component crimping operation unit that are disposed at positions pinching the component loading operation unit from both sides and crimp the component loaded by the component loading operation unit on the substrate where the operation for loading the component is performed by the component loading operation unit, a first substrate transport unit disposed to be movable in a horizontal direction between the component loading operation unit and the first component crimping operation unit, and a second substrate transport unit disposed to be movable in the horizontal direction between the component loading operation unit and the second component crimping operation unit,
- a step of crimping one of the components on the substrate by the first component crimping operation unit by transporting the substrate in a state of remaining placed on a substrate placement stage to the first component crimping operation unit by moving the first substrate transport unit to the first component crimping operation unit side after transporting the substrate to the component loading operation unit in a state where the substrate is placed on the substrate placement stage of the first substrate transport unit and performing the operation for loading the component on the substrate by the component loading operation unit;
- and
- a step of crimping one of the components on the substrate by the second component crimping operation unit by transporting the substrate in a state of remaining placed on the substrate placement stage to the second component crimping operation unit by moving the second substrate transport unit to the second component crimping operation unit side after transporting the substrate to the component loading operation unit in a state where the substrate is placed on the substrate placement stage of the second substrate transport unit and performing the operation for loading the component on the substrate by using the component loading operation unit.
Dependencies are inferred from the claim text.