Thermal ink jet printhead
AssigneeHewlett-Packard Development Company, L.P.
InventorsLawrence H. White, Anthony M. Fuller, Huyen Pham
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Abstract
The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.
Claims20
A method for fabricating a thermal ink jet printhead, comprising:
- depositing a first metal layer on a substrate having a thickness to form a power bus;
- depositing a first dielectric layer;
- forming a via in the first dielectric layer to connect the first metal layer to a second metal layer;
- depositing the second metal layer;
- depositing a resistive layer;
- forming a thermal resistor in the resistive layer;
- depositing a second dielectric layer;
- and
- removing a portion of the second dielectric layer using a directional etch process.
A thermal ink jet printhead, comprising:
- a substrate;
- a resistive layer;
- a first metal layer between the substrate and the resistive layer having a thickness to form a power bus;
- a second metal layer adjacent to the resistive layer to connect the thermal resistor to a control circuit;
- a first dielectric layer between the first metal layer and the second metal layer, the first dielectric layer including a via to connect the first metal layer to the second metal layer;
- a second dielectric layer between the second metal layer and a polymer layer, wherein the second dielectric layer is directionally removed from an ink feed slot;
- a thermal resistor formed in the resistive layer;
- and
- a thermal inkjet chamber formed in the polymer layer.
A method for fabricating a thermal ink jet printhead, comprising:
- depositing a first dielectric layer on a substrate;
- depositing a first metal layer having a thickness to form a power bus;
- depositing a second dielectric layer;
- forming a via in the second dielectric layer to connect the first metal layer to a second metal layer;
- depositing the second metal layer to connect a thermal resistor to circuitry;
- forming circuit traces and space for the thermal resistor in the second metal layer;
- depositing a resistive layer;
- forming the thermal resistor in the resistive layer;
- depositing a third dielectric layer;
- removing a first portion of the third dielectric layer using a dry etch process;
- and
- removing a second portion of the third dielectric layer using a wet etch process.
Dependencies are inferred from the claim text.