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US 9,771,498 B2Granted
Moisture curable polyamides and methods for using the same
AssigneeHenkel IP & Holding GmbH
InventorsDwight Heinrich, Tina Nataniel
Life of this patent
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Abstract
The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.
Claims16
A process for producing a moisture-curable hot melt composition comprising:
- producing a polyamide by the polycondensation of:
- 66 to 80 Eq % of at least one dimerized C12 to C24 unsaturated fatty acid;
- 20 to 30 Eq % of at least one C6 to C22 aliphatic dicarboxylic acid;
- optionally 3 to 4 Eq % of carboxylic acid;
- optionally 3 to 12 Eq % of monomer fatty acid;
- 45 to 47 Eq % of at least one C6 to C22 alkylene diamine;
- 37 to 53 Eq % of at least one heterocyclic secondary diamine;
- and
- optionally 6 to 18 Eq % of at least one polyoxyalkylenediamine;
- wherein the Eq % of the acid components is equal to 100 and the Eq % of the amine components is equal to 100;
- reacting the polyamide with a chloromethylphenyl-functionalized alkoxysilane under conditions resulting in attachment of chloromethylphenyl-functionalized di-alkoxysilane or tri-alkoxysilane terminal groups to the polyamide,
- wherein the molar ratio of the functionalized alkoxysilane component to the polyamide component ranges from greater than 1:1 to about 2:1.
9 more elements
A moisture-curable hot melt composition comprising the reaction product of:
- a polyamide that is the polycondensation product of:
- 66 to 80 Eq % of at least one dimerized C12 to C24 unsaturated fatty acid;
- 20 to 30 Eq % of at least one 06 to C22 aliphatic dicarboxylic acid;
- optionally 3 to 4 Eq % of carboxylic acid;
- optionally 3 to 12 Eq % of monomer fatty acid;
- 45 to 47 Eq % of at least one C6 to C22 alkylene diamine;
- 37 to 53 Eq % of at least one heterocyclic secondary diamine;
- and
- optionally 6 to 18 Eq % of at least one polyoxyalkylenediamine;
- wherein the Eq % of the acid components is equal to 100 and the Eq % of the amine components is equal to 100;
- and
- an epoxide-functionalized alkoxysilane or a chloromethylphenyl-functionalized alkoxysilane under conditions resulting in attachment of epoxide-functionalized or chloromethylphenyl-functionalized di-alkoxysilane or tri-alkoxysilane terminal groups to the polyamide,
- wherein the molar ratio of the functionalized alkoxysilane component to the polyamide component ranges from greater than 1:1 to about 2:1;
- wherein the moisture-curable adhesive composition has an elongation of 40% to 185% as measured using ASTM Standard D 638-00.
11 more elements
Dependencies are inferred from the claim text.