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US 9,769,955 B2Granted
Refrigerating apparatus
AssigneeDaikin Industries, Ltd.
InventorsJunichi Teraki, Akihiko Oguri
Life of this patent
Estimating the term…
Abstract
A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.
Claims17
A refrigerating apparatus, including:
- a refrigerant circuit which performs a refrigeration cycle by circulating a refrigerant;
- a printed circuit board on which a heat generating component is mounted;
- a cooler attached to the heat generating component and a refrigerant pipe of the refrigerant circuit, for cooling the heat generating component with the refrigerant flowing in the refrigerant pipe;
- and
- a casing in which at least the printed circuit board, the refrigerant pipe, and the cooler are disposed,
- the refrigerating apparatus comprising:
- a support member attaching the cooler to the printed circuit board in such manner that a load of the cooler is supported by the printed circuit board;
- and
- a fixing member fixing the printed circuit board to the casing in such manner that the printed circuit board is supported by the casing,
- wherein the casing supports the load of the cooler by operation of the fixing member which transfers the load of the cooler from the printed circuit board to the casing.
7 more elements
Dependencies are inferred from the claim text.