Composition for encapsulation film, encapsulation film, and electronic device comprising the same

An encapsulation film for an electronic device, including a composition comprising:

• a base resin having a repeating unit of Chemical Formula 1;
• and
• an additive having a compound represented by Chemical Formula 2,
• wherein the additive is included in an amount of 5 to 30 parts by weight with respect to 100 parts by weight of the base resin:
• where, in Chemical Formula 1 and Chemical Formula 2,
• each of R1 and R2 independently represents hydrogen or an alkyl group having 1 to 12 carbon atoms,
• n and q are 1 or more,
• L is a single bond or an organic linker formed of at least one selected from the group consisting of an alkylene, an arylene, an ether, an ester, a carbonyl, an allyl, an alkylallyl, an acryloyl, an alkenylene and combinations thereof, and
• P is a polar functional group selected from the group consisting of an acid anhydride group, an amide group, an alkoxy group, an alcohol group, an aldehyde group, a carbonyl group, a carboxyl group, an ester group, an ether group, an epoxy group, an amino group, a sulfone group, a hydroxyl group, and a maleic acid.