Sonar transducer array assembly and methods of manufacture thereof

A method of manufacturing a sonar transducer array assembly, the method comprising the steps of:

• attaching a first surface of a plurality of transducer elements to adhesive areas on a first flexible circuit so that the transducer elements form a transducer array;
• attaching an opposing second surface of the transducer array to adhesive areas on a second flexible circuit;
• electrically connecting the transducer array to the first flexible circuit and the second flexible circuit;
• filling spaces between the transducer elements with an insulating material;
• and
• placing a mechanical insulating sleeve on the assembly to cover a portion of the first and second flexible circuits corresponding to the adhesive areas at which each transducer element is attached to the first and second flexible circuits and to align with a third surface of each transducer element in the transducer array, the third surface of each transducer element configured to transmit and receive an acoustic pressure wave;
• wherein the first and second flexible circuits further include a base layer and a stiffener having greater rigidity than the base layer;
• and
• wherein the stiffener is aligned with only the adhesive areas at which each transducer element is attached to the first and second flexible circuits.

A sonar transducer array assembly manufactured by a method comprising the steps of:

• attaching a plurality of transducer elements to an adhesive area on a first flexible circuit so that the transducer elements form a transducer array;
• attaching the transducer array to an adhesive area on a second flexible circuit;
• electrically connecting the transducer array to the first flexible circuit and the second flexible circuit;
• filling spaces between the transducer elements with an insulating material;
• and
• placing a mechanical insulating sleeve on the assembly to cover a portion of the first and second flexible circuits corresponding to the adhesive areas at which each transducer element is attached to the first and second flexible circuits and to align with a third surface of each transducer element in the transducer array, the third surface of each transducer element configured to transmit and receive an acoustic pressure wave;
• wherein the first and second flexible circuits further include a base layer and a stiffener having greater rigidity than the base layer;
• and
• wherein the stiffener is aligned with only the adhesive areas at which each transducer element is attached to the first and second flexible circuits.