Method of making a monolithically integrated RF system

A method for constructing an RF device, comprising:

• forming a first sub-assembly by
• first depositing on a first surface of a first substrate a first plurality of layers including at least one layer each of a conductive material and a sacrificial material;
• and
• first controlling said deposit of said first plurality of layers to form on said first surface
• at least a first peripheral wall surrounding a first walled area of said first substrate, said first peripheral wall extending a first predetermined distance away from said first surface to form a first ledge,
• at least one first signal processing component disposed on said first surface of said first substrate within said walled area, and
• at least one first transmission line element disposed on and extending a second predetermined distance away from and in a direction which is normal to said first surface;
• and
• forming a second sub-assembly by
• second depositing on a second surface of a second substrate a second plurality of layers including at least one layer each of said conductive material and said sacrificial material;
• and
• second controlling said deposit of said second plurality of layers to form on said second surface
• at least a second peripheral wall surrounding a second walled area of said second substrate, said second peripheral wall extending a third predetermined distance away from said second surface to form a second ledge,
• at least one second signal processing component within the second walled area, and
• at least one second transmission line element disposed on and extending a fourth predetermined distance away from and in a direction normal to said second surface;
• and
• positioning said second ledge on said first ledge to suspend the second sub-assembly on the first sub-assembly with said first walled area aligned with said second walled area;
• forming an electrical connection directly between the first and second transmission line elements by aligning a central axis of the first transmission line element with a central axis of the second transmission line element and establishing direct electrical contact between abutting ends of the first and second transmission line elements;
• and
• forming said electrical connection aligned with a location where said first ledge abuts said second ledge to establish an interconnect between a first conductive trace disposed on the first substrate and a second conductive trace disposed on the second substrate.