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US 9,756,731 B2Granted
Package for housing electronic component and electronic device
AssigneeKYOCERA Corporation
InventorNoritaka Niino
Life of this patent
Estimating the term…
Abstract
A package for housing an electronic component, which is provided with: a substrate part that comprises an insulating substrate, which is formed of a ceramic sintered body and comprises a recess portion, and a wiring conductor which is provided on the insulating substrate; and a metal portion which is formed of a sintered body of a getter metal material and is directly bonded to the recess portion.
Claims12
A package for housing an electronic component, comprising:
- an insulating substrate made from a ceramic sintered body, the insulating substrate comprising a recess portion, and a wiring conductor provided on the insulating substrate;
- a metal portion made from a sintered body of a getter metal material directly bonded to the recess portion;
- and
- a cavity portion provided on an inner surface of the recess portion, wherein the metal portion is positioned within the cavity portion and fills the cavity portion.
1 more element
Dependencies are inferred from the claim text.