Chip-integrated through-plating of multi-layer substrates

A method for producing a laminate for contacting at least one electronic component, the method comprising:

• arranging an insulating layer between a first metal layer and a second metal layer,
• electrically contacting the metal layers to each other in at least one contact region,
• generating at least one recess in the at least one contact region in the insulating layer,
• generating at least one embossing or bulging in the at least one contact region at least in the first metal layer, wherein a distance between the metal layers in regions of the at least one embossing or bulging is reduced, and
• laminating the metal layers to the insulating layer,
• wherein dimensions of the at least one embossing or bulging are sufficient for taking up at least one electronic component,
• wherein at least one light emitting diode (LED) is inserted as the electronic component, and the at least one electronic component is inserted into the at least one embossing or bulging and is connected in conductive manner therein, such that the electronic component is taken up in the at least one embossing or bulging entirely with respect to a circumference of the electronic component and with respect to a height of the electronic component,
• wherein the embossing or bulging is formed such that an angle of a side wall with respect to the first metal layer is established,
• a surface of the at least one embossing or bulging is a reflective surface, produced by a stamp which is polished to be of optical quality, wherein the stamp produces a smooth surface of the embossing or bulging, and
• wherein the first metal layer and the second metal layer at least partially touch each other.