Semiconductor device having a first circuit board mounted with a plurality of semiconductor elements and a second circuit board mounted with a plurality of electronic components

A semiconductor device comprising:

• a first circuit board including a first principal surface mounted with a plurality of semiconductor elements constituting a main circuit;
• a second circuit board including a second principal surface mounted with a plurality of electronic components and being arranged such that a back surface of the second principal surface opposes the first principal surface;
• a plurality of connecting terminals securely connected to the first circuit board;
• and
• a case covering the first circuit board and the second circuit board, wherein:
• each of the connecting terminals includes an external terminal connecting portion, having an end surface to connect an external terminal thereto and located at the second principal surface side of the second circuit board faces, and a substrate-fixed portion securely connected to the first circuit board at a single point with a screw, the external terminal connecting portion and the substrate-fixed portion being eccentrically located when viewed from a direction in which the first circuit board and the second circuit board are opposed,
• a hole is provided in the case to allow the end surface of the external terminal connecting portion to be exposed therethrough, the end surface being secured to a corresponding external terminal with a bolt whereby the external terminal connecting portion may abut an inner wall of the case defining the hole when the external terminal is secured to the end surface with the bolt,
• a seal attachment portion is provided on a portion of the external terminal connecting portion including the end surface to attach thereto a seal member to seal a gap between the external terminal connecting portion and the case, the seal attachment portion of a top end surface of the external terminal connecting portion having a plurality of straight regions and a shape of the hole corresponding to a shape of the top end surface,
• at least one of the connecting terminals includes a reduced sectional area portion having a sectional area smaller than an area of the top end surface in a region facing the plurality of electronic components arranged on the second circuit board on the external terminal connecting portion,
• the reduced sectional area portion is provided in a region from the seal attachment portion to an end in an opposite side of the end surface and has a substantially half-circle-shaped cross-section,
• the external terminal connecting portion includes a projecting portion that projects from the reduced sectional area portion toward the substrate-fixed portion, and
• the top end surface has a substantially polygonal shape and the hole has a substantially polygonal shape, and
• wherein the electronic component includes a capacitor located adjacent to the reduced sectional area portion and the end surface of the external terminal connecting portion is positioned to overlap the capacitor when viewed from the direction in which the first circuit board and the second circuit board are opposed.