US 9,756,728 B2Granted

Component-mounted structure

AssigneePanasonic Intellectual Property Management Co., Ltd.

InventorsTadahiko Sakai, Hideki Eifuku, Koji Motomura

Life of this patent

Estimating the term…

Loading patent…

Abstract

Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

Claims15

Dependent claims

A component-mounted structure comprising:

a first object having a plurality of first electrodes,
a second object as an electronic component, the second object having second electrodes respectively corresponding to the plurality of first electrodes,
a joint portion joining the first electrodes and the corresponding second electrodes to each other, and
a resin-reinforcing portion covering at least part of the joint portion, wherein:
the joint portion includes a first core and a first intermetallic compound layer covering a surface of the first core, the first intermetallic compound layer including an intermetallic compound of a first metal and a second metal having a melting point lower than the first metal, the first core being made of the first metal,
the resin-reinforcing portion includes a first portion existing between the first electrodes and the second electrodes, and a second portion other than the first portion,
the second portion includes a particulate matter which has a second core and a second intermetallic compound layer, the second core being made of the first metal, the second intermetallic compound layer including the intermetallic compound of the first metal and the second metal,
an amount of the particulate matter included in the second portion being 0.1 to 10 vol %,
a melting point of the first intermetallic compound and a melting point of the second intermetallic compound are higher than a melting point of the second metal,
the first core contacts with at least one of the first electrodes and at least one of the second electrodes via the first intermetallic compound layer,
the joint portion further includes a first solder layer covering a surface of the first intermetallic compound layer and including the second metal, and
the second metal is an alloy including at least one selected from the group consisting of Sn, Pb, Ag, Zn, Bi, In, Cu, and Sb.

9 more elements

A component-mounted structure comprising:

a first object having a plurality of first electrodes,
a second object as an electronic component, the second object having second electrodes respectively corresponding to the plurality of first electrodes,
a joint portion joining the first electrodes and the corresponding second electrodes to each other, and
a resin-reinforcing portion covering at least part of the joint portion, wherein:
the joint portion includes a first resin core, a first metallic layer covering a surface of the first resin core and a first intermetallic compound layer covering a surface of the first metallic layer, the first intermetallic compound layer including an intermetallic compound of a first metal and a second metal having a melting point lower than the first metal, the first metallic layer being made of the first metal,
the resin-reinforcing portion includes a first portion existing between the first electrodes and the second electrodes, and a second portion other than the first portion,
the second portion includes a particulate matter which has a second resin core, a second metallic layer covering a surface of the second resin core and a second intermetallic compound layer, the second metallic layer being made of the first metal, the second intermetallic compound layer including the intermetallic compound of the first metal and the second metal,
an amount of the particulate matter included in the second portion being 0.1 to 10 vol %,
a melting point of the first intermetallic compound and a melting point of the second intermetallic compound are higher than a melting point of the second metal,
the first metallic layer contacts with at least one of the first electrodes and at least one of the second electrodes via the first intermetallic compound layer,
the joint portion further includes a solder layer made of the second metal disposed on the first intermetallic compound layer, and
the intermetallic compound includes Cu and at least one selected from the group consisting of Pb, Ag, Zn, Bi, In and Sb.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/423,417Filed 22 May 2013
Priority: JP 2012-19224631 Aug 2012
Published: US 2015/0208509 A123 Jul 2015
Granted: 5 Sep 2017
Term ends: Not estimatedThe source records don’t support an estimate.

Classification25 codes

H05K 1/18
Printed circuits: structurally associated with non-printed electric components
H05K 1/0373
Consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement: containing additives, e.g. fillers
H05K 1/147
Structural association of two or more printed circuits: at least one of the printed circuits being bent or folded, e.g. by using a flexible…
H05K 3/323
By conductive adhesives: by applying an anisotropic conductive adhesive layer over an array of pads