Composition for forming conductive pattern and resin structure having conductive pattern thereon

A resin structure having a conductive pattern, comprising:

• a polymeric resin substrate;
• dispersed in the polymeric resin substrate, a non-conductive metal compound including a first metal element and a second metal element, having a R3m or P63/mmc space group in crystal structure, the structure comprising a plurality of first layers including at least one metal of the first meta element selected from the group consisting of Cr, Mo, Mn, Fe, Sn and W, and a second layer including at least one metal of the second metal element selected from the group consisting of Cu, Ag and Ni and arranged between the first layers, wherein the non-conductive metal compound has a general formula ABX2 where A is selected from the group consisting of Cu, Ag and Ni, B is selected from the group consisting of Cr, Mo, Mn, Fe, Sn and W, and X is oxygen, nitrogen, or sulfur;
• a flame retardant dispersed in the polymeric resin substrate;
• an adhesion-activated surface including a metal nucleus including a first or a second metal or an ion thereof exposed on a surface of a predetermined region of the polymeric resin substrate;
• and a conductive metal layer formed on the adhesion-activated surface.