Method of making a circuitized substrate
Assigneei3 Electronics, Inc.
InventorsRabindra N. Das, Kostas I. Papathomas, Voya R. Markovich
Life of this patent
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Abstract
A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.
Claims9
A method of making a circuitized substrate, said method comprising:
- providing a first electrically conductive layer;
- providing at least one organic dielectric layer including first and second opposing surfaces;
- providing a second electrically conductive layer and positioning said second electrically conductive layer such that said at least one organic dielectric layer is located substantially between said first and second electrically conductive layers;
- forming at least one opening within said at least one organic dielectric layer and extending from said first electrically conductive layer to said second electrically conductive layer;
- and
- positioning a quantity of conductive paste within said at least one opening, said quantity of electrically conductive paste electrically coupling said first and second electrically conductive layers, said quantity of conductive paste including:
- a plurality of micro-particles having an average size of from about one micron to about fifty microns of at least one metallic component selected from the group:
- copper, silver, gold, silver-coated copper, gold-coated copper, and alloys thereof;
- a plurality of nano-particles having an average size of from about 0.01 microns to about one micron of said at least one metallic component selected from the group:
- copper, silver, gold, silver-coated copper, gold-coated copper, and alloys thereof;
- and
- a plurality of micro-particles particles having an average size of from about one micron to about fifty microns of at least one low melting point metallurgy selected from the group:
- tin-lead, bismuth-tin, bismuth-tin-iron, tin, tin-silver, tin-gold, tin-silver-zinc, tin-silver-zinc-copper, tin-bismuth-silver, tin-copper, tin-copper-silver, tin-indium-silver, tin-antimony, tin-zinc, tin-zinc-indium, copper-based solders, and alloys thereof.
Dependencies are inferred from the claim text.