Multilayer laminated substrate structure
AssigneesGlobal Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
InventorsJia-Liang Chen, Ting-Ju Lin, Ling-Chih Chou
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Abstract
A multilayer laminated substrate structure includes plural substrate layers stacked with each other, and a conductive via portion. One of the substrate layers is provided with a through hole. The conductive via portion includes a first signal conductive pad having a first rib, a second signal conductive pad having a second rib, and a conductive body which is disposed in the through hole and is electrically connected to the first rib and the second rib. The first signal conductive pad and the second signal conductive pad are disposed on two opposite surfaces of the substrate layer, and the first rib and the second rib are arranged in a staggered manner in relation to each other.
Claims17
A multilayer laminated substrate structure, comprising:
- a first substrate layer having a first through hole penetrating through the first substrate layer;
- a second substrate layer stacked on the first substrate layer;
- and
- a first conductive via portion, comprising:
- a first signal conductive pad which is formed on one surface of the first substrate layer and comprises a plurality of first ribs, a first gap is formed between any two neighboring ones of the first ribs;
- a second signal conductive pad which is formed on another surface of the first substrate layer and comprises at least one second rib, wherein an orthographic projection of the second rib onto the one surface of the first substrate lever is located within one of the first gaps;
- and
- a first conductive body which is disposed in the first through hole and is respectively connected to the first rib and the second rib, wherein the first rib and the second rib are arranged in a staggered manner in relation to each other.
A multilayer laminated substrate structure, comprising:
- a plurality of substrate layers stacked with each other;
- and
- a conductive via portion penetrating through one of the substrate layers, the conductive via portion comprising:
- a first radiating pattern formed on one surface of the substrate layer, the first radiating pattern having a plurality of first ribs which are radially arranged;
- and
- a second radiating pattern formed on another surface of the substrate layer, the second radiating pattern having a plurality of second ribs which are radially arranged,
- wherein an orthographic projection of the second rib onto another of the substrate layers and an orthographic projection of the first rib onto the another of the substrate layers are arranged in a staggered manner in relation to each other.
A multilayer laminated substrate structure, comprising:
- a plurality of substrate layers stacked with each other,
- a first conductive via portion penetrating through one of the substrate layers, the first conductive via portion comprising a first radiating pattern formed on one surface of the substrate layer, the first radiating pattern having a plurality of first ribs which are radially arranged;
- and
- a third conductive via portion penetrating through the substrate layer in which the first conductive via portion is disposed, wherein the third conductive via portion and the first conductive via portion are adjacent and arranged abreast, the third conductive via portion comprising a third radiating pattern formed on the surface of the substrate layer, the third radiating pattern having a plurality of third ribs which are radially arranged,
- wherein a longitudinal axis of one of the first ribs passes through a gap formed between two neighboring ones of the third ribs.
Dependencies are inferred from the claim text.