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US 9,756,718 B2Granted
Module board
AssigneeMurata Manufacturing Co., Ltd.
InventorsYuji Kataoka, Koichi Kanryo
Life of this patent
Estimating the term…
Abstract
A module board includes a base substrate. Electronic components are mounted on a first principal surface of the base substrate. The mounted electronic components are sealed by a sealing resin containing an SiO2 filler. A top surface and side surfaces of the sealing resin are covered with a shield layer containing a carbon filler, which is flat powder, as a conductive component. A terminal electrode is formed on a second principal surface of the base substrate that is disposed opposite to the first principal surface of the base substrate.
Claims6
A module board comprising:
- a base substrate;
- first and second electronic components each mounted on one of principal surfaces of the base substrate;
- a sealing resin formed so as to seal the electronic component mounted on the one of the principal surfaces of the base substrate;
- a shield layer covering the sealing resin;
- and
- a shield section containing a metal and provided so as to contact with a portion of the shield layer,
- wherein the shield layer is a resin film containing carbon as a conductive component,
- wherein the shield section is provided between the sealing resin and the shield layer, and
- wherein the shield section is disposed only above the first electronic component, and does not extend to an area above the second electronic component.
6 more elements
Dependencies are inferred from the claim text.