Electronic, optoelectronic, or electric arrangement

A configuration selected from the group consisting of an electronic configuration, an optoelectronic configuration, and an electrical configuration, the configuration comprising:

• a circuit carrier having a metallic heat conductor;
• and
• a component embedded or inserted in said circuit carrier, said component having a rewiring layer and at least one structural element selected from the group consisting of an electrical structural element, an electronic structural element and an optoelectronic structural element, said structural element having electrical terminal devices and said rewiring layer configured to enlarge a spacing dimension of said electrical terminal devices for a connection to said circuit carrier, said rewiring layer having a carrier substrate and a metallic heat conducting path, said metallic heat conducting path having a metal track formed on a first main surface of said carrier substrate, and said metallic heat conducting path establishing a metallic-thermal connection of said rewiring layer to said metallic heat conductor of said circuit carrier;
• wherein said circuit carrier has a passage opening formed therein, which extends through said carrier substrate;
• wherein said metallic heat conductor, or at least a subregion thereof, is formed by an inner wall defining said passage opening;
• and
• wherein said heat conductor is formed by a metallic sleeve inserted into said passage opening.