Multi-tiered tamper-resistant assembly system and method

An encapsulant comprising:

• high-radiopacity particulates embedded in the encapsulant, wherein the high-radiopacity particulates comprises a Z value greater than 50;
• and
• an electronic tripwire embedded in the encapsulant, wherein the electronic tripwire is configured to be coupled to an integrated circuit configured to render the integrated circuit inoperable for signal processing in response to the electronic tripwire being severed,
• wherein the electronic tripwire is configured to dissolve in a solution,
• the solution configured to dissolve the encapsulant,
• the readout integrated circuit resistant to being dissolved by the solution, and
• the dissolving acts to trigger the electronic tripwire;
• wherein the electronic tripwire is configured to be coupled to a power source, and
• the trip wire prevents a charge from being released from the power source and dissipated through the readout integrated circuit.