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US 9,756,155 B2Granted
Housing wall
AssigneesSeibersdorf Labor GmbH, Ait Austrian Institute of Technology GmbH
InventorsWalter Ettel, Manfred Bammer, Gernot Schmidt
Life of this patent
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Abstract
A housing wall for a data communications device includes a metallic and electrically conductive main body. A slotted area having a number of slots is provided in a region of the housing wall, in such a way that in a region of the slotted area the housing wall is permeable to magnetic fields for inductively coupling-in signals for wireless communication.
Claims11
A housing wall for a data communications device, the housing wall comprising:
- a metallic and electrically conductive main body including a region having a slotted area, said region having said slotted area being permeable to magnetic fields for inductively coupling-in signals for wireless communication;
- said region including at least one first ply and at least one second ply each having a plurality of slots formed within said slotted area;
- said slots of said at least one first ply and said slots of said at least one second ply being mutually offset in said slotted area;
- and
- an insulating layer formed between said at least one first ply and said at least one second ply, said insulating layer spacing said at least one first ply and said at least one second ply apart from one another and electrically insulating said at least one first ply and said at least one second ply from one another.
2 more elements
Dependencies are inferred from the claim text.