Method for manufacturing an optical communication device

A method of manufacturing an optical communication device, comprising:

• positioning a first thermally conductive sub-mount configured to accommodate an optical laser on a carrier wafer substantially adjacent to a first pre-defined break line in the carrier wafer;
• positioning a second sub-mount configured to accommodate an optical modulator on the carrier wafer substantially adjacent to a second pre-defined break line in the carrier wafer;
• aligning the first thermally conductive sub-mount in x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer;
• securing the first thermally conductive sub-mount to a thermally conductive and electrically non-conductive spacer;
• securing the thermally conductive and electrically non-conductive spacer to a thermo-electrical cooler in a position that defines a gap between the first thermally conductive sub-mount and the thermo-electrical cooler;
• securing the second sub-mount to an optical device platform;
• and
• removing a portion of the carrier wafer between the first thermally conductive and second sub-mounts.