US 9,755,642 B2Granted

Low cost CMOS chip with tape automated bonding (polyamide)

OwnerShivaling Shrishail Mahant Shetti, Anand Baligatti +5inventors

InventorsShivaling Shrishail Mahant Shetti, Anand Baligatti, Prakash Donur, Veeranna Hooli, Ranganath Y Goudar, Anil Agasar, Manjunathreddi G Baragundi

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Abstract

In view of the foregoing, an embodiment herein provides a low cost system. The system includes a bipolar array, a CMOS chip. The bipolar array includes one or more bipolar integrated circuits. The CMOS chip is programmed by a single level of metal. The bipolar array and the CMOS chip is mounted on a substrate using TAB polyamide. The TAB includes a polyamide film with one or more metal patterns chemically etched by programming three metal layers simultaneously to obtain one or more components. The one or more components are mounted in a package, and a small system can be realized. An external capacitor supplies an ac power source to the bipolar array. The bipolar array produces a rectified voltage and a lower voltage power for the enhanced gate array. An output of the enhanced gate array drives bipolar drivers of DC motor, stepper motor, BLDC motor, and LED assemblies.

Claims10

Dependent claims

A low cost system comprising:

a bipolar array (102), wherein said bipolar array (102) comprises a plurality of bipolar integrated circuits (IC), wherein said plurality of bipolar IC is programmed with a single level metal;
a plurality of enhanced gate arrays (104, 106 and 108), wherein said plurality of enhanced gate arrays (104, 106 and 108) of a CMOS chip is programmed by a single level of metal to communicate with said bipolar array (102) to obtain a plurality of small systems, wherein said bipolar array (102) and said CMOS chip are mounted on a substrate using a tape automated bonding (TAB) polyamide, wherein said TAB comprises a polyamide film with one or more metal patterns chemically etched, wherein by programming three metal layers simultaneously in said plurality of bipolar IC, in said CMOS chip, and on said TAB to obtain one or more components, wherein said one or more components are mounted in a package, and a small system can be realized;
a capacitor (202);
and
a high power or high precision resistor (204), wherein said series impedance of said capacitor (202) supplies an ac power source to said bipolar array (102), wherein said bipolar array (102) produces a rectified voltage and a lower voltage power for said plurality of enhanced gate arrays (104, 106 and 108) comprising at least one of, but not limited to (i) cascade circuits, (ii) current drive circuits, (iii) analog circuits, (iv) digital circuit, (v) RF circuit, and (vi) current driven circuit,
wherein an output of said plurality of enhanced gate arrays (104, 106 and 108) drive bipolar drivers of DC motor, stepper motor, BLDC motor, and LED assemblies.

3 more elements

A low cost system comprising:

a bipolar array (102), wherein said bipolar array (102) comprises plurality of bipolar integrated circuits (IC), wherein said plurality of bipolar IC is programmed with a single level metal;
a plurality of enhanced gate arrays (104, 106 and 108), wherein said plurality of enhanced gate arrays (104, 106 and 108) of a CMOS chip is programmed by a single level of metal to communicate with said bipolar array (102) to obtain a plurality of small systems, wherein said bipolar array (102) and said CMOS chip are mounted on a IC substrate using a tape automated bonding (TAB) polyamide, wherein said TAB comprises a polyamide film with one or more metal patterns chemically etched, wherein by programming three metal layers simultaneously in said plurality of bipolar IC, in said CMOS chip, and on said TAB to obtain one or more components, wherein said one or more components are mounted in a package, and a small system can be realized, wherein said tape automated bonding polyamide with said bipolar array (102), and said CMOS chip is mounted in a DIP package or directly on a printed circuit board (PCB);
a capacitor (202);
and
a high power or high precision resistor (204), wherein said series impedance of said capacitor (202) supplies an ac power source to said bipolar array (102), wherein said bipolar array (102) produces a rectified voltage and a lower voltage power for said plurality of enhanced gate arrays (104, 106 and 108) comprising at least one of, but not limited to (i) cascade circuits, (ii) current drive circuits, (iii) analog circuits, (iv) digital circuit, (v) RF circuit, and (vi) current driven circuit, wherein an output of said plurality of enhanced gate arrays (104, 106 and 108) drive bipolar drivers of DC motor, stepper motor, BLDC motor, and LED assemblies,
wherein a power is generated using a full wave rectifier and a regulator with high current bipolar device and a zener diode to provide a voltage reference.

3 more elements

Dependencies are inferred from the claim text.