Method of cutting substrate and method of manufacturing display apparatus
AssigneeSamsung Display Co., Ltd.
InventorsJunghwa You, Taeyong Kim, Hyojin Kim, Ilyoung Jeong, Gyoowan Han, Jekil Ryu, Jinho Lee
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Abstract
A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.
Claims26
A method of cutting a substrate, the method comprising:
- forming a first protective layer on a first surface of the substrate;
- forming a removal area where a portion of the first shielding layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam;
- forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam;
- and
- after the forming of the cutting area, removing the first protective layer from the substrate.
A method of manufacturing a display apparatus comprising a display unit formed on a substrate, the method comprising:
- forming a first protective layer on a first surface of the substrate;
- forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer with a first laser beam;
- and
- forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam;
- and
- after the forming of the cutting area, removing the first protective layer from the substrate.
Dependencies are inferred from the claim text.