Method for forming projections and depressions, sealing structure, and light-emitting device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorYusuke Nishido
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Abstract
A novel method for forming projections and depressions is provided. A novel sealing structure is provided. A novel light-emitting device is provided. A first step of forming a film containing at least two kinds of metals having different etching rates over a surface; a second step of heating the film so that the metal having a lower etching rate segregates; a third step of selectively etching the metal having a higher etching rate; and a fourth step of selectively etching the surface using a residue containing the metal having a lower etching rate are included.
Claims13
A sealing structure comprising:
- a substrate;
- a sealing substrate opposite a surface of the substrate;
- a sealant between the substrate and the sealing substrate;
- and
- a sealed structure sealed in a region surrounded by the substrate, the sealing substrate, and the sealant,
- wherein the surface of the substrate is provided with:
- projections and depressions;
- a surface being adjacent to the projections and depressions and being flatter and smoother than the projections and depressions;
- and
- a metal film in contact with the flat and smooth surface,
- wherein the sealant is in contact with the projections and depressions, and
- wherein the metal film comprises metal elements non-uniformly distributed.
A light-emitting device comprising:
- a substrate;
- a sealing substrate opposite a surface of the substrate;
- a sealant between the substrate and the sealing substrate;
- and
- a light-emitting element sealed in a region surrounded by the substrate, the sealing substrate, and the sealant,
- wherein the surface of the substrate is provided with:
- projections and depressions;
- a surface being adjacent to the projections and depressions and being flatter and smoother than the projections and depressions
- a metal film in contact with the flat and smooth surface;
- and
- a conductive film overlapping with the surface,
- wherein the light-emitting element is electrically connected to the conductive film,
- wherein the sealant is adjacent to the projections and depressions, and
- wherein the metal film comprises metal elements non-uniformly distributed.
Dependencies are inferred from the claim text.